Omaha School Board President Justin Wayne has confirmed to WOWT 6 News that the OPS board will consider a plan Thursday to cut a proposed school bond issue into two phases for needed upgrades.
The current plan calls for a bond issue of $683 million. In the new plan, the first phase will total $421 million and the second phase, around 300 million.
The first phase includes renovations and replacements of existing facilities, with the majority of the costs attributed to elementary schools. Also fire, life safety and technology upgrades.
The public may learn more about the revised plan at an OPS board meeting at 5:30 p.m. at the TAC Building.
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